主要设备:金相试样镶嵌机、金相试样磨抛光机、光谱磨样机、激光打标机等。
Main Equipment: Metallographic sample inlaying machine, metallographic sample grinding polishing machine, spectral grinding prototype, laser marking machine, etc.
主要试验项目:光谱试样的磨制、金相试样的粗磨/精磨/抛光/腐蚀、金属材料的激光打标等工作。
Main Test Items: Grinding of spectral samples, coarse grinding/fine grinding/polishing/corrosion of metallographic samples, laser marking of metal materials, etc.